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羅斌森

  • NVB082N65S3F

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active

極速報(bào)價(jià)

型號(hào)
 品牌 封裝 批號(hào) 查看
H11AG23SD ON 6-SMD New 詳細(xì)
MC74HC597ADG ON 16-SOIC New 詳細(xì)
FAN2518S28X ON SOT-23-5 New 詳細(xì)
NCP1216AP100 ON 7-PDIP New 詳細(xì)
MC10EP131FAG ON New 詳細(xì)
MC74HC541ANG ON 20-PDIP New 詳細(xì)
MC74HC74ADTR2 ON New 詳細(xì)
BCX799_D27Z ON TO-92-3 New 詳細(xì)
KA5H02659RN ON 8-DIP New 詳細(xì)
74LCX112SJ ON New 詳細(xì)
KSC945CGTA ON TO-92-3 New 詳細(xì)
FIN1002M5 ON SOT-23-5 New 詳細(xì)
FQA7N60 ON TO-3P New 詳細(xì)
4N28TM ON 6-DIP New 詳細(xì)
MMBF5486 ON SOT-23-3 New 詳細(xì)
FDMB2308PZ ON 6-MLP (2x3) New 詳細(xì)
MC10H605FN ON 28-PLCC (11.51x11.51) New 詳細(xì)
NM93C46LN ON 8-DIP New 詳細(xì)
BD679G ON TO-225AA New 詳細(xì)
MC74LVX08DTG ON 14-TSSOP New 詳細(xì)