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  • XC7Z007S-1CLG225C

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq?-7000
    Part Status : Active
    Architecture : MCU, FPGA
    Core Processor : Single ARM? Cortex?-A9 MPCore? with CoreSight?
    RAM Size : 256KB
    Peripherals : DMA
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 667MHz
    Primary Attributes : Artix?-7 FPGA, 23K Logic Cells
    Operating Temperature : 0°C ~ 85°C (TJ)
    Package / Case : 225-LFBGA, CSPBGA
    Supplier Device Package : 225-CSPBGA (13x13)

極速報價

型號
 品牌 封裝 批號 查看
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XCS10XL-5VQ100C Xilinx 100-VQFP (14x14) New 詳細(xì)
XC7Z007S-1CLG400I Xilinx 400-CSPBGA (17x17) New 詳細(xì)
XC2VP40-6FGG676I Xilinx 676-FBGA (27x27) New 詳細(xì)
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