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羅斌森

  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

極速報(bào)價(jià)

型號(hào)
 品牌 封裝 批號(hào) 查看
NST3904DXV6T5 ON SOT-563 New 詳細(xì)
74LVX74M ON New 詳細(xì)
MC74ACT241MELG ON SOEIAJ-20 New 詳細(xì)
BC239ATA ON TO-92-3 New 詳細(xì)
RFD16N06LESM9A ON TO-252AA New 詳細(xì)
MPSA06RLRMG ON TO-92-3 New 詳細(xì)
KSC945COTA ON TO-92-3 New 詳細(xì)
FDLL333 ON SOD-80 New 詳細(xì)
1.5KE11A ON Axial New 詳細(xì)
TIP32A ON TO-220-3 New 詳細(xì)
NCV8842PWGEVB ON New 詳細(xì)
H11A817DW ON 4-DIP New 詳細(xì)
FDS6298 ON 8-SOIC New 詳細(xì)
74F823SPC ON New 詳細(xì)
MAN5450 ON New 詳細(xì)
LM79L05ACZX ON TO-92-3 New 詳細(xì)
BZX55C4V7_T50A ON DO-35 New 詳細(xì)
FSUSB42MUX ON 10-MSOP New 詳細(xì)
74LVT162240MTD ON 48-TSSOP New 詳細(xì)
FDD3N40TF ON D-Pak New 詳細(xì)